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Topcon, Leica Sponsor REAL 2015 3D Sensor Conference

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REAL 2015: Capture, Compute, Create will be held Feb. 25–26 at Fort Mason Center in San Francisco. REAL is designed to explore the professional 3D sensing, creation, and visualization industries. It includes an executive summit and a world’s fair of cutting-edge 3D demonstrations, and is organized by Autodesk.

According to organizers, “From drones to autonomous cars, industrial robots to major engineering works, and game consoles to tomorrow’s mobile phones, 3D sensors are suddenly everywhere. And several decades after first grabbing headlines, VR and 3D printing are hot again, attracting billions in investment, and moving beyond early adopters to professionals. But it is the sum total, where sensing meets making, where big change is brewing.”

Sponsors include Leica Geosystems and Topcon. Two Topcon experts will speak at the event: Jason Hallett, Topcon vice president of global product management, and Eduardo Falcon, executive vice president and general manager of the GeoPositioning Solutions Group.

“The Topcon line of advanced 3D imaging and mapping technologies are designed for a wide range of geospatial applications providing data-rich results,” Falcon said. “REAL 2015 presents opportunities to explore how our mobile and static scanning solutions can be utilized in forward-thinking ways, as 3D sensing and reality capture continue to permeate traditional and non-traditional industries alike.”

 

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